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@Article{BonettiFrCaSaViCoTr:2006:AdStDi,
               author = "Bonetti, Lu\í and Francisco, s and Capote, Gil and Santos, 
                         L\ú and Vieira, cia and Corat, Evaldo Jos\é and 
                         Trava-Airoldi, Vladimir Jesus",
          affiliation = "Instituto Nacional de Pesquisas Espaciais, Laborat\ó and {rio 
                         Associado de Sensores e Materiais (INPE.LAC)} and Instituto 
                         Nacional de Pesquisas Espaciais, Laborat\ó and {rio Associado 
                         de Sensores e Materiais (INPE.LAC)} and Instituto Nacional de 
                         Pesquisas Espaciais, Laborat\ó and {rio Associado de Sensores 
                         e Materiais (INPE.LAC)} and Instituto Nacional de Pesquisas 
                         Espaciais, Laborat\ó and {rio Associado de Sensores e 
                         Materiais (INPE.LAC)} and Instituto Nacional de Pesquisas 
                         Espaciais, Laborat\ó and {rio Associado de Sensores e 
                         Materiais (INPE.LAC)}",
                title = "Adhesion studies of diamond-like carbon films deposited on Ti6Al4V 
                         substrate with a silicon interlayer",
              journal = "Thin Solid Films",
                 year = "2006",
               volume = "In press",
             keywords = "Diamond-like carbon (DLC), PECVD, Silicon interlayer, Adhesion.",
             abstract = "Diamond-like carbon (DLC) films have proven quite advantageous in 
                         many tribological applications due to their low friction 
                         coefficient, their extreme hardness, and more recently their high 
                         adherence on different substrate materials. However, for many 
                         applications, DLC films as thick as 2 {\`{\i}}m are required, 
                         which cause high residual stress. In order to overcome this 
                         problem, this study observed the behavior of different thicknesses 
                         of silicon interlayer between DLC films and Ti6Al4V substrates. 
                         The study also analyzed the relation of growth parameters to the 
                         mechanical properties of DLC films. Silicon and DLC films were 
                         grown by using a rf-PECVD at 13.56 MHz with silane and methane 
                         atmospheres, respectively. The contribution of an interlayer 
                         thickness to the adhesion between the DLC films and Ti6Al4V 
                         substrate was evaluated by using a micro-scratch technique. The 
                         hardness and friction coefficient were evaluated by using 
                         microindentation and lateral force microscopy (LFM), respectively. 
                         Raman scattering spectroscopy was used to characterize the film 
                         quality. A correlation was found between the intrinsic stress and 
                         adhesion of DLC film and the parameters of the silicon interlayer 
                         growth. The addition of a silicon interlayer successfully reduced 
                         intrinsic stress of the films, even as measured by using a 
                         perfilometry technique.",
                 issn = "0040-6090",
             language = "en",
           targetfile = "Adhesion studies of diamond like carbon.pdf",
        urlaccessdate = "17 jan. 2021"
}


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