author = "Riehl, Roger Ribeiro and Cachut{\'e}, Liomar de Oliveira",
          affiliation = "{Instituto Nacional de Pesquisas Espaciais (INPE)} and {Instituto 
                         Nacional de Pesquisas Espaciais (INPE)}",
                title = "Thermal management of surveillance equipments electronic 
                         components using pulsating heat pipes",
            booktitle = "Proceedings...",
                 year = "2014",
                pages = "513--518",
         organization = "Intersociety Conference on Thermal and Thermomechanical Phenomena 
                         in Electronic Systems (ITherm), 14.",
            publisher = "Institute of Electrical and Electronics Engineers Inc.",
             keywords = "Electronic component, Electronics cooling, Pulsating heat pipe, 
                         Surveillance equipment, Thermal control, Space surveillance.",
             abstract = "Surveillance systems have presented to be important applications 
                         for high performance thermal control devices, especially passive 
                         ones using heat pipe technology. This is usually applied when the 
                         heat source is located far from the heat sink and the use of 
                         liquid cooling or any other active thermal control system is not 
                         possible. Design and application of pulsating heat pipes (PHPs) 
                         and heat pipes become an indicated solution especially for 
                         restricted areas for integration. This investigation is focused on 
                         presenting the thermal control management of electronic components 
                         of a surveillance system using an open loop PHP with conventional 
                         heat pipes. Despite the relatively high temperature differences 
                         observed between the heat source and sink (up to 25 C), the open 
                         loop PHP was able to transport the rejected heat (up to 40 W) from 
                         the electronic components to a remote heat dissipation area, while 
                         keeping their temperatures within the required range (below 80 C) 
                         with relatively high thermal conductances (up to 1.6 W/C). The 
                         heat pipe has demonstrated the capability of spreading the heat, 
                         positively affecting the PHP operation, as this combined solution 
                         has proven to be stable and reliable with promising results.",
  conference-location = "Orlando",
      conference-year = "may 27-30, 2014",
                  doi = "10.1109/ITHERM.2014.6892324",
                  url = "http://dx.doi.org/10.1109/ITHERM.2014.6892324",
                 isbn = "9781479952670",
                label = "scopus 2014-11 RiehlCach:2014:ThMaSu",
             language = "en",
           targetfile = "riehl_thermal.pdf",
        urlaccessdate = "17 jan. 2021"