@Article{UedaBeloReutPara:2001:FoSiSi,
author = "Ueda, Mario and Beloto, Antonio Fernando and Reuther, H. and
Parascandola, S.",
affiliation = "Instituto Nacional de Pesquisas Espaciais, Laborat{\'o}rio
Associado de Plasmas, (INPE, LAP)",
title = "Plasma immersion ion implantation of nitrogen in Si: formation of
SiO2, Si3N4 and stressed layers under thermal and sputtering
effects",
journal = "Surface and Coatings Technology",
year = "2001",
volume = "136",
number = "1-3",
pages = "244--248",
month = "Feb",
keywords = "plasma immersion ion implantation, silicon nitride, surface
modification, Auger electron spectroscopy.",
abstract = "Plasma immersion ion implantation (PIII) of nitrogen in silicon
(Si) wafers was carried out using a de glow discharge plasma
source and a hard tube pulser. Ion irradiation times ranging from
3 to 60 min were used to accumulate different doses. Surface
analysis of these samples was carried out by Auger electron
spectroscopy (AES), revealing a high atomic concentration of
nitrogen (up to 60%) in the as-implanted Si wafer, besides the
presence of different impurities as oxygen and carbon in
significant quantities. Depth profiles of these elements were
obtained as well as of compound species as SiO2 and Si3N4, using
this high-energy resolution AES. Comparing the concentration
profiles of implanted nitrogen in Si and the corresponding
retained doses in these samples, it was possible to understand the
thermal and sputtering effects in our present PIII experiment.
High-resolution XRD results corroborate the formation of highly
stressed layers in the as-implanted substrates. These experimental
results are compared to simulations obtained by TRIDYN code. (C)
2001 Elsevier Science B.V. All rights reserved.",
copyholder = "SID/SCD",
issn = "0257-8972",
language = "en",
targetfile = "51.pdf",
urlaccessdate = "15 jun. 2024"
}