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@Article{RibeiroGomeBaldReze:2023:DeSaAr,
               author = "Ribeiro, Bruno and Gomes, Newton Adriano dos Santos and Baldan, 
                         Maur{\'{\i}}cio Ribeiro and Rezende, Mirabel Cerqueira",
          affiliation = "{Universidade Federal de S{\~a}o Paulo (UNIFESP)} and {Instituto 
                         Nacional de Pesquisas Espaciais (INPE)} and {Instituto Nacional de 
                         Pesquisas Espaciais (INPE)} and {Universidade Federal de S{\~a}o 
                         Paulo (UNIFESP)}",
                title = "Designing sandwich architecture towards glass fiber/epoxy 
                         reinforced multi-walled carbon nanotube buckypaper composites for 
                         electromagnetic interference shielding",
              journal = "Electronic Materials Letters",
                 year = "2023",
               volume = "19",
               number = "2",
                pages = "184--191",
                month = "Mar.",
             keywords = "Buckypaper, Carbon nanotubes, Electrical properties, 
                         Electromagnetic interference shielding.",
             abstract = "Macroscale carbon nanotube layers, also known as buckypapers (BP), 
                         were produced and inserted between glass fiber/epoxy prepregs to 
                         evaluate the electromagnetic interference shielding effectiveness 
                         (EMI SE) in the X band range. The number of BP layers (S) and the 
                         wave-transmitting layer thickness (d) diverged so that five 
                         sandwich configurations were proposed in this work. The optimized 
                         architecture (S = 4 and d = 1.0 mm) led to a high shielding 
                         performance, revealing an EMI SE up to ~ 60 dB with a dominant 
                         absorption mechanism and an imposing Fabry-P{\'e}rot resonance 
                         peak. The fabrication of BP composites is uncomplicated and highly 
                         straightforward for large-scale manufacturing of promising EMI 
                         shielding materials with broad applications in electronics.",
                  doi = "10.1007/s13391-022-00382-4",
                  url = "http://dx.doi.org/10.1007/s13391-022-00382-4",
                 issn = "1738-8090",
             language = "en",
           targetfile = "s13391-022-00382-4.pdf",
        urlaccessdate = "16 jun. 2024"
}


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