@InProceedings{CostaVlas:2011:SiMeEf,
               author = "Costa, Rafael Lopes and Vlassov, Valeri",
          affiliation = "{} and {Instituto Nacional de Pesquisas Espaciais (INPE)}",
                title = "Simulation Method for Effective Thermal Conductivity Determination 
                         of Complex Boards",
            booktitle = "Anais...",
                 year = "2011",
         organization = "Workshop em Engenharia e Tecnologia Espaciais, 2. (WETE).",
            publisher = "INPE",
              address = "S{\~a}o Jos{\'e} dos Campos",
             keywords = "Mec{\^a}nica e Controle Orbital, Effective thermal conductivity, 
                         PCB.",
             abstract = "Resistors, capacitors, transistors, and LEDs are components used 
                         in electronic systems, normally assembled to printed circuit 
                         boards PCBs. Such components generate heat in operation which must 
                         be conducted away efficiently to frames where the board is fixed. 
                         The components operating temperatures depend on heat dissipation 
                         rate, mounting technology, component placement and finally 
                         effective thermal conductivity of the PCB. The temperature of some 
                         components may reach about 100º C while the PCB frame is kept at 
                         near-ambient constant temperature. The reliability of electronic 
                         components is directly related to operating temperature. Hence, a 
                         correct temperature prediction shall be provided by the thermal 
                         project of the board under the hottest operation conditions. The 
                         PCB effective thermal conductivity is a significant parameter 
                         which influences the component temperature and its determination 
                         for complex multi-layer PCBs is not a simple task. In space 
                         applications, the only way to spread and reject heat of electronic 
                         equipments is by thermal conduction once there is no air available 
                         to apply convectionbased cooling systems such as heat sinks and 
                         fans. In this paper we present a simulation method used to 
                         determine the effective thermal conductivity of multi-layered 
                         boards. Such method uses a CAD based thermal model builder named 
                         SINDA/FLUINT Thermal Desktop and aims to determine the effective 
                         conductivity of a PCB by comparison between a detailed 
                         multi-layered anisotropic model and an equivalent homogeneous 
                         model. The method was applied for PCB-frame configurations typical 
                         for space applications. The simulation outcomes were compared to 
                         the values of effective conductivity obtained by analytical 
                         methods. Besides, a sensitivity analysis is performed on 
                         variations in component mounting technology and PCB layers 
                         placement. The results are discussed in a way of evaluation of 
                         applicability of existing methods and estimation of inherent 
                         uncertainty of PCB thermal effective conductivity determination.",
  conference-location = "S{\~a}o Jos{\'e} dos Campos",
      conference-year = "3 - 4 maio",
                 issn = "2236-2606",
             language = "en",
         organisation = "INPE",
                  ibi = "8JMKD3MGP7W/3A7BEDL",
                  url = "http://urlib.net/ibi/8JMKD3MGP7W/3A7BEDL",
           targetfile = "1307.pdf",
        urlaccessdate = "14 maio 2024"
}