@InProceedings{SilvaJúniorRossUeda:2015:PIBaPr,
               author = "Silva J{\'u}nior, Ataide Ribeiro da and Rossi, Jos{\'e} Osvaldo 
                         and Ueda, M{\'a}rio",
          affiliation = "{Instituto Nacional de Pesquisas Espaciais (INPE)} and {Instituto 
                         Nacional de Pesquisas Espaciais (INPE)} and {Instituto Nacional de 
                         Pesquisas Espaciais (INPE)}",
                title = "PIII in batch processing mode using HV Blumlein pulser with pulse 
                         extended to the microsecond range",
            booktitle = "Proceedings...",
                 year = "2015",
         organization = "IEEE International Power Modulator and High Voltage Conference 
                         (IPMHVC 2014)",
             keywords = "batch processing, HV Blumlein pulser, metal ceramic interface, 
                         plasma immersion ion implantation.",
             abstract = "In this work, high-energy PIII process is used to solve the 
                         problem of soldering terminals to silver film electrodes without 
                         compromising their adhesion to ceramic substrates in electronic 
                         components such as ceramic capacitors. Besides, PIII 
                         batch-processing mode is other important technique used to 
                         optimize the treatment of metallic and polymeric surfaces for 
                         industrial applications such as components with rigid 
                         qualification used in the aerospace industry. For this, a sample 
                         holder made of stainless steel (SS304) with the shape of a cage 
                         allows applying the PIII processing on both faces of the flat 
                         components, simultaneously. As the batch-mode process requires 
                         increased pulse duration, the redesign of a HV Blumlein pulser was 
                         made to increase the pulse duration from 1.0 \μs to 5.0 
                         \μs, but at the cost of decreasing the output voltage from 
                         60 kV during treatment to less than 20 kV. The longer pulse 
                         duration permits deeper penetration of ions into the material 
                         surface.",
  conference-location = "Santa Fe, USA",
      conference-year = "1-4 June",
        urlaccessdate = "27 abr. 2024"
}