@Article{Riehl:2019:ThEnUs,
               author = "Riehl, Roger Ribeiro",
          affiliation = "{Instituto Nacional de Pesquisas Espaciais (INPE)}",
                title = "Thermal enhancement using nanofluids on high heat dissipation 
                         electronic components",
              journal = "Journal of Nanofluids",
                 year = "2019",
               volume = "8",
               number = "1",
                pages = "30--40",
                month = "Jan.",
             keywords = "Thermal Enhancement, Electronics Cooling, Thermal Control, 
                         Pressure Drop, Nanofluids.",
             abstract = "The paper deals with the development of a thermal management 
                         solution for a surveillance equipment, which needs to dissipate 
                         high levels of heat loads using both active and passive thermal 
                         control devices, that has been designed, simulated, built and 
                         tested in real operating conditions. The thermal management system 
                         was designed to use both a single-phase forced circulation loop 
                         and heat pipes using copper oxide (CuO)-water nanofluid, applied 
                         to promote the thermal management up to 50 kW of heat generated by 
                         several arrays of electronic components, being dissipated to the 
                         environment by a fan cooling system. The heat pipes collect the 
                         heat from electronic components that were far from the main 
                         single-phase forced circulation loop, rejecting the heat directly 
                         in its cold plates. Tests results of the thermal management system 
                         operating in real conditions show that with an addition of up to 
                         20% by mass of CuO nanoparticles to the base fluid in the 
                         single-phase system, enhancements of up to 12% in the heat 
                         transfer coefficients were achieved but the increase in the 
                         pressure drop was around 32%. This shows that the use of nanofluid 
                         in the heat pipes resulted in a substantial decrease in the heat 
                         source temperature. When applying nanofluids in heat pipes, the 
                         maturity of this technology has reached Technology Readiness Level 
                         (TRL) of 8 for surveillance systems.",
                  doi = "10.1166/jon.2019.1563",
                  url = "http://dx.doi.org/10.1166/jon.2019.1563",
                 issn = "2169-432X",
             language = "en",
        urlaccessdate = "18 abr. 2024"
}