@InProceedings{Riehl:2018:ThPeNa,
               author = "Riehl, Roger Ribeiro",
          affiliation = "{Instituto Nacional de Pesquisas Espaciais (INPE)}",
                title = "Thermal Performance of Nanofluids Applied to the Temperature 
                         Control of Electronic Components",
            booktitle = "Proceedings...",
                 year = "2018",
         organization = "Heat Powered Cycles Conference",
             keywords = "thermal enhancement, electronics cooling, thermal control, 
                         pressure drop, nanofluids.",
             abstract = "The subject of this article is related to the development of a 
                         thermal management solution for a surveillance equipment, which 
                         needs to dissipate high levels of heat loads using both active and 
                         passive thermal control devices. A thermal management system was 
                         designed to use both a singlephase forced circulation loop and 
                         heat pipes using copper oxide (CuO)-water nanofluid, designed to 
                         promote the thermal management of up to 50 kW of heat generated by 
                         several arrays of electronic components, being dissipated to the 
                         environment by a fan cooling system. The heat pipes collect the 
                         heat from electronic components that are far from the main 
                         single-phase forced circulation loop, rejecting the heat directly 
                         in its cold plates. Results show that with an addition of 20% by 
                         mass of CuO nanoparticles to the base fluid in the single-phase 
                         system, enhancements of 12% in the heat transfer coefficients were 
                         achieved but the increase in the pressure drop was around 32%. The 
                         use of nanofluid in the heat pipes resulted in a substantial 
                         decrease in the heat source temperature. Upon using nanofluids in 
                         heat pipes, the maturity of this technology is considerably 
                         high.",
  conference-location = "Germany",
      conference-year = "16-19 sept.",
             language = "en",
           targetfile = "riehl_thermal.pdf",
        urlaccessdate = "10 maio 2024"
}